¼¼¼Ç Æ®·¢
FB1
ÀüÀڱ⡤¿øÀÚ·Â
|
||
FB1-1
10:50-11:10
Å׶óÇ츣Ã÷Æĸ¦ »ç¿ëÇÑ ¹ÝµµÃ¼ ÆÐÅ°Áö Ĩ Á¤·Ä ¹× ÈÚ ½Ç½Ã°£ °Ë»ç ±â¼ú °³¹ß
In-situ inspection technique for chip alignment and warpage in semiconductor package using terahertz waves